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SIGC15T60
IGBT Chip
FEATURES: • 600V Trench & Field Stop technology • low VCE(sat) • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling
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This chip is used for: • power module • discrete components Applications: • drives
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Chip Type SIGC15T60
VCE 600V
ICn 30A
Die Size 3.92 x 3.88 mm2
Package sawn on foil
Ordering Code Q67050A4335-A101
MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Recommended storage environment 3.92 x 3.88 3.154 x 3.154 0.608 x 1.083 15.2 / 10.
SIGC15T60 Datasheet
