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SIGC15T60UN
High Speed IGBT Chip in NPT-technology
FEATURES: • • • • • • low Eoff 600V NPT technology 100µm chip short circuit prove positive temperature coefficient easy paralleling This chip is used for: • SGB15N60HS Applications: • Welding • PFC • UPS
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Chip Type SIGC15T60UN
VCE 600V
ICn 15A
Die Size 3.2 x 4.55 mm2
Package sawn on foil
Ordering Code Q67050-A4221A101
MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 3.2 x 4.55 14.6 / 10.7 2.2 x 1.7 1.1 x 0.
SIGC15T60UN Datasheet
