SIGC39T60 Datasheet | Infineon

.. IGBT Chip Features : - 600V Trench & Field Stop technology - low VCE(sat) - low turn-off losses - short tail current - positive temperature coefficient - easy paralleling This chip is used for: - power module - discrete ponents Applications: - drives Chip Type SIGC39T60 VCE 600V ICn 75A Die Size 6.59 x 5.91 mm2 Package sawn on foil Ordering Code Q67050A4339-A101 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Remended storage...