Infineon Technologies CLX32-00
HiRel X-Band GaAs Power-MESFET
MAXIMUM RATINGS
Parameter Drain-source voltage Drain-gate voltage Gate-source voltage Drain current Gate forward current Compression Level 1) Operation Range 1 Symbol VDS VDG VGS ID IG PC Values 11 13 -6 1400 10 1.5 at VDS ≤ 8 V 2.5 at VDS ≤ 7 V 3.5 at VDS ≤ 6 V Unit V V V mA mA dB Compression Level 2) Operation Range 2 Compression Level 3) Operation Range 3 Junction temperature Storage temperature range Total power dissipation 4) Soldering temperature Thermal Resistance Junction-soldering point Notes.: 5) PC PC TJ Tstg Ptot Tsol 3.5 at VDS ≤ 6 V tbd. 175 - 65...+ 175 5.4 230 dB dB °C °C W °C Rth JS ≤ 25 K/W 1) Operation Range 1: 270 mA ≤ ID ≤ 540 mA 2) Operation Range 2: ID > 540 mA 3) Operation Range 3: ID < 270 mA 4) At TS = + 40 °C. For TS > + 40 °C derating is required. 5) During 15 sec. maximum. The same terminal shall not be resoldered until 3 minutes have elapsed. Semiconductor Group 2 of 10 Draft D, September 99 CLX32ELECTRICAL CHARACTERISTICS
(at TA=25°C; unless otherwise specified) Parameter Symbol min.