Overview: CYW20719 AIROC™ Bluetooth® & Bluetooth® LE system on chip
Enhanced low power
CYW20719 is a Bluetooth® 5.4-pliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver with Bluetooth® LE, EDR and BR. The device is intended for use in audio, IoT, sensors (medical, home, security, and so forth) and human interface device (HID) applications. Manufactured using an advanced 40nm CMOS low-power fabrication process, CYW20719 employs high level of integration to reduce external ponents, thereby minimizing application footprint and costs. This datasheet provides details of the functional, operational, and electrical characteristics of CYW20719 device. It is intended for hardware, design, application, and OEM engineers.
Functional block diagram MODEM RF PKA SHA LCU 96 MHz ARM CM4 w/FPU Flash 1 MB RAM 448 KB Patch RAM 64 KB ROM 2 MB Patch Control AES Security Engine RX/TX Bluetooth® 5.4 MAC AHB Bus Matrix PWM x6 ADC Peripheral UART 1x I2C M/S 1x I2C master HCI UART Key Scan Watchdog Random Number Generator SPIFFY X2 (MIPI
DBI-C, SPI, Quad SPI) GPIO x40 Hardware Peripheral Block HP- LPO 128 KHz XTALOSC 32 KHz LP- LPO 32 KHz HID OFF Timer XTALOSC 24 MHz Clock Management Core Buck Digital LDO
RF LDO Power Management Unit Datasheet .infineon. Please read the Important Notice and Warnings at the end of this document page 1 002-26644 Rev.
