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DF4-19MR20W3M1HF_B11 - IGBT

General Description

J J Datasheet www.infineon.com Please read the sections "Important notice" and "Warnings" at the end of this document Revision 1.00 2022-07-15 DF4-19MR20W3M1HF_B11 EasyPACK™ module Table of contents Table of contents Description

Key Features

  • Electrical features - VDSS = 2000 V - IDN = 60 A / IDRM = 120 A - High current density - Low inductive design.
  • Mechanical features - Rugged mounting due to integrated mounting clamps - PressFIT contact technology - Integrated NTC temperature sensor Potential.

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DF4-19MR20W3M1HF_B11 EasyPACK™ module EasyPACK™ module with CoolSiC™ Trench MOSFET and PressFIT / NTC Features • Electrical features - VDSS = 2000 V - IDN = 60 A / IDRM = 120 A - High current density - Low inductive design • Mechanical features - Rugged mounting due to integrated mounting clamps - PressFIT contact technology - Integrated NTC temperature sensor Potential applications • Solar applications Product validation • Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068 Description J J Datasheet www.infineon.com Please read the sections "Important notice" and "Warnings" at the end of this document Revision 1.00 2022-07-15 DF4-19MR20W3M1HF_B11 EasyPACK™ module Table of contents Table of contents Description . . . . . . . . . . . .