F3L200R07W2S5F_B11 - EasyPACK module

Features

CoolSiCTM Schottky diode gen 5.
Increased blocking voltage capability up to 650V.
Low switching losses Mechanical Features.
Al2O3 substrate with low thermal resistance.
Compact design.
PressFIT contact technology.
Rugged mounting due to integrated mounting clamps Module Label Code Barcode Code 128 DMX - Code Content of the Code Module Serial Number Module Material Number Production Order Number Datecode (Production Year) Datecode.

Infineon

Datasheet Details

Part number	F3L200R07W2S5F_B11
Manufacturer	Infineon
File Size	1.09 MB
Description	EasyPACK module
Datasheet	F3L200R07W2S5F_B11 Datasheet
Additional preview pages of the F3L200R07W2S5F_B11 datasheet.

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F3L200R07W2S5F_B11 EasyPACK™ModulmitTRENCHSTOP™5undCoolSiC™SchottkyDiodeundPressFIT/NTC EasyPACK™modulewithTRENCHSTOP™5andCoolSiC™SchottkydiodeandPressFIT/NTC J PotentielleAnwendungen • 3-Level-Applikationen • Motorantriebe • SolarAnwendungen • USV-Systeme ElektrischeEigenschaften • CoolSiCTMSchottkyDiodeGen5 • ErhöhteSperrspannungsfestigkeitauf650V • NiedrigeSchaltverluste MechanischeEigenschaften • Al2O3 Substrat mit kleinem thermischen Widerstand • KompaktesDesign • PressFITVerbindungstechnik • Robuste Montage durch integrierte Befestigungsklammern VCES = 650V IC nom = 100A / ICRM = 200A PotentialApplications • 3-level-applications • Motordrives • Solarapplications • UPSsystems ElectricalFeatures • CoolSiCTMSchottkydiodegen5 • Increasedb

Published: May 23, 2025 |