Datasheet4U Logo Datasheet4U.com

F3L500R12W3H7_H11 Datasheet IGBT

Manufacturer: Infineon

Overview: 44,43 36,08 32,88 29,68 23,28 20,08 7,28 4,08 0 4,08 7,28 10,48 13,68 16,88 20,08 23,28 29,68 32,88 36,08 44,43 W00211902.

General Description

- Datasheet www.infineon.com 04 |nderung des Bohrbildes Please read the sections "Import0a3nt noLtaicyeo"uatn˜dnd"Weraurnngingasl"taVt t5h.e7enneduofVth7i.s3document 02 Layout˜nderung, Zwei Pine (P1,N1) pro Substrat hinzu steimark steim Rebvisiskioonpi1n.0g0m 2024o-0r2-29 steim bertalan berta F3L500R12W3H7_H11 EasyPACK™ module Table of contents Table of contents Description .

.

.

Key Features

  • Electrical features - VCES = 1200 V - IC nom = 500 A / ICRM = 1000 A - Ultra fast IGBT chips - Low ind-ucDtievteadilessiganbout hole specification for contacts refer to AN2009-01 chapter 2 - Low sw-itcDhiinagmleotsesress of drill P1,15mm - Low VCE-,saCt opper thickness in hole 25~50um - Suitable Infineon gate drivers can be found under https://www. infineon. com/gdfinder.
  • Mechanical features - 3.2 kV AC 1 minute insulation - High current pin - PressFIT contact technology - Rugge.

F3L500R12W3H7_H11 Distributor