FD500R65KE3-K
Key Features
- LowVCEsat MechanicalFeatures
- AlSiC base plate for increased thermal cycling capability
- Extended storage temperature down to Tstg =
- PackagewithCTI>600
- Package with enhanced insulation of 10.4kV AC 10s
- di/dt tP ≤ 10 µs, Tvj = 125°C Wärmewiderstand,ChipbisGehäuse Thermalresistanc
