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FF11MR12W2M1HP_B11 - EasyPACK module

General Description

J Datasheet www.infineon.com Please read the sections "Important notice" and "Warnings" at the end of this document Revision 0.20 2022-09-16 FF11MR12W2M1HP_B11 EasyPACK™ module Table of contents Table of contents Description

Key Features

  • Electrical features - VDSS = 1200 V - IDN = 75 A / IDRM = 150 A - Low inductive design - Low switching losses.
  • Mechanical features - Pre-applied thermal interface material - PressFIT contact technology - Integrated NTC temperature sensor - Rugged mounting due to integrated mounting clamps Potential.

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The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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FF11MR12W2M1HP_B11 EasyPACK™ module Preliminary datasheet EasyPACK™ module with CoolSiC™ Trench MOSFET and PressFIT / NTC / TIM Features • Electrical features - VDSS = 1200 V - IDN = 75 A / IDRM = 150 A - Low inductive design - Low switching losses • Mechanical features - Pre-applied thermal interface material - PressFIT contact technology - Integrated NTC temperature sensor - Rugged mounting due to integrated mounting clamps Potential applications • High-frequency switching application • DC/DC converter • Motor drives • UPS systems • DC charger for EV Product validation • Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068 Description J Datasheet www.infineon.