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FF11MR12W2M1HP_B11 Datasheet Easypack Module

Manufacturer: Infineon

Overview: FF11MR12W2M1HP_B11 EasyPACK™ module Preliminary datasheet EasyPACK™ module with CoolSiC™ Trench MOSFET and PressFIT / NTC /.

General Description

J Datasheet .infineon.

Please read the sections "Important notice" and "Warnings" at the end of this document Revision 0.20 2022-09-16 FF11MR12W2M1HP_B11 EasyPACK™ module Table of contents Table of contents Description .

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Key Features

  • Electrical features - VDSS = 1200 V - IDN = 75 A / IDRM = 150 A - Low inductive design - Low switching losses.
  • Mechanical features - Pre-applied thermal interface material - PressFIT contact technology - Integrated NTC temperature sensor - Rugged mounting due to integrated mounting clamps Potential.

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