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FP10R12W1T4P_B11 - IGBT

Key Features

  • Low switching losses.
  • Low VCEsat.
  • Trench IGBT 4.
  • VCEsat with positive temperature coefficient Mechanical Features.
  • Al2O3 substrate with low thermal resistance.
  • Compact design.
  • PressFIT contact technology.
  • Rugged mounting due to integrated mounting clamps.
  • Pre-applied Thermal Interface Material Module Label Code Barcode Code 128 DMX - Code Content of the Code Module Serial Number Module Material Number Production.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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FP10R12W1T4P_B11 EasyPIM™ModulmitTrench/FeldstoppIGBT4undEmitterControlled4DiodeundPressFIT/bereits aufgetragenemThermalInterfaceMaterial EasyPIM™modulewithTrench/FieldstopIGBT4andEmitterControlled4diodeandPressFIT/pre-applied ThermalInterfaceMaterial VCES = 1200V IC nom = 10A / ICRM = 20A TypischeAnwendungen • Hilfsumrichter • Klimaanlagen • Motorantriebe ElektrischeEigenschaften • NiedrigeSchaltverluste • NiedrigesVCEsat • TrenchIGBT4 • VCEsatmitpositivemTemperaturkoeffizienten MechanischeEigenschaften • Al2O3 Substrat mit kleinem thermischen Widerstand • KompaktesDesign • PressFITVerbindungstechnik • Robuste Montage durch integrierte Befestigungsklammern • Thermisches Interface Material bereits aufgetragen TypicalApplications • Auxiliaryi