Infineon Technologies FS01MR08A8MA2LBC
Drive G2 module
| Part No. | FS01MR08A8MA2LBC |
|---|---|
| Datasheet | FS01MR08A8MA2LBC Download |
| Manufacturer |  Infineon Technologies |
| Description | Drive G2 module |
| Buy | Stock & Price |
FEATURES
● Electrical features - VDSS = 750 V - IDN = 620 A - New semiconductor material - silicon carbide - Low RDS,on - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 175°C - Short-time extended operation temperature Tvj,op = 200 °C● Mechanical features - 4.2 kV DC 1 second insulation - High creepage and clearance distances - Compact design - High power density - Direct-cooled PinFin base plate - High-performance Si3N4 ceramic - Guiding elements for PCB and cooler assembly - Integrated temperature sensing diode - PressFIT contact technology - RoHS compliant, lead-free - UL 94 V0 module frame Potential applications
● Automotive applications
● (Hybrid) electrical vehicles (H)EV
● Motor drives
● Commercial, construction and agricultural vehicles (CAV) Product validation
● Qualified according to AQG 324, release no.: 03.1/2021
DESCRIPTION
T1 T3 T5 TS1 TS2 T2 T4 T6 TS3 Datasheet Please read the sections "Important notice" and "Warnings" at the end of this document Revision 1.00 2024-03-14 FS01MR08A8MA2LBC HybridPACK™ Drive G2 module Table of contents Table of contentsDESCRIPTION
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