• Part: FS1150R08A8P3LBC
  • Description: Drive G2 module
  • Manufacturer: Infineon
  • Size: 1.26 MB
Download FS1150R08A8P3LBC Datasheet PDF
Infineon
FS1150R08A8P3LBC
Features - Electrical features - VCES = 750 V - ICN = 1150 A / ICRM = 2300 A - Blocking voltage 750 V - Low VCE,sat - Low switching losses - Low Qg and Crss - Low inductive design - Tvj,op = 175°C - Integrated on-chip temperature sensor - Short-time extended operation temperature Tvj,op = 185 °C - Mechanical features - 4.2 k V DC 1 second insulation - High creepage and clearance distances - Direct-cooled Pin Fin base plate - Guiding elements for PCB and cooler assembly - Press FIT contact technology - Ro HS pliant, lead-free - UL 94 V0 module frame - High-performance Si3N4 ceramic - High power and thermal cycling capability Potential applications - Automotive applications - (Hybrid) electrical vehicles (H)EV Product validation - Qualified according to AQG 324, release no.: 03.1/2021 Description The Hybrid PACKTM Drive is a very pact six-pack module (750V/1150A) optimized for hybrid and electric vehicles. Datasheet .infineon. Please read the sections "Important notice" and "Warnings" at...