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FS3L40R12W2H7P_B11 - Ultra fast IGBT

General Description

J Datasheet www.infineon.com Please read the sections "Important notice" and "Warnings" at the end of this document Revision 1.00 2023-12-12 FS3L40R12W2H7P_B11 EasyPACK™ 2B module Table of contents Table of contents Description

Key Features

  • Electrical features - VCES = 1200 V - IC nom = 40 A / ICRM = 80 A - Ultra fast IGBT chips - Overload operation up to 175°C - Low switching losses - Low VCE,sat - Suitable Infineon gate drivers can be found under https://www. infineon. com/gdfinder.
  • Mechanical features - 3 kV AC 1 minute insulation - Al2O3 substrate with low thermal resistance - Compact design - PressFIT contact technology - Rugged mounting due to integrated mounting clamps - Pre-applied thermal interface materia.

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Full PDF Text Transcription (Reference)

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FS3L40R12W2H7P_B11 EasyPACK™ 2B module Final datasheet EasyPACK™ 2B module and PressFIT / pre-applied thermal interface material / NTC Features • Electrical features - VCES = 1200 V - IC nom = 40 A / ICRM = 80 A - Ultra fast IGBT chips - Overload operation up to 175°C - Low switching losses - Low VCE,sat - Suitable Infineon gate drivers can be found under https://www.infineon.