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HYE18L128160BC-75 - DRAMs for Mobile Applications

Key Features

  • M O B I L E - R A M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.2 to 1 mm. Impressive Power Consumption Savings I N F I N E O N ’ S M O B I L E - R A M devices achieve these dramatic power consumption savings by measuring the temperature with an integrated sensor.

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Infineon Specialty DRAMs Mobile-RAM w w w. i n f i n e o n . c o m / m e m o r y / Mo b i l e - R A M Never stop thinking....

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