HYE18L256160BF-75
feature phones) Digital cameras MP3 players I N F I N E O N ’ S M O B I L E
- R A M product line bines Ultra low-power consumption for battery-powered systems with Extra pact chip-scale packages for space-constrained applications I N F I N E O N ’ S M O B I L E
- R A M cuts power consumption by up to 80 % (depending on operating conditions and system design)
- thanks to its latest memory technology, low operating voltage (1.8 V) and its unique, integrated power management features
. M O B I L E
- R A M D E V I C E S e in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon’s proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form factor by reducing package heights from 1.2 to 1 mm.
Impressive Power Consumption Savings
I N F I N E O N ’ S M O B I L E
- R A M devices achieve these dramatic power consumption savings by measuring the temperature with an integrated sensor and...
