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IDC10D120T6M
Diode EMCON 4 Medium Power Chip
FEATURES: • 1200V EMCON 4 technology • soft, fast switching
This chip is used for: • low / medium power modules
A
• low reverse recovery charge
• small temperature coefficient
C
Applications:
• low / medium power drives
Chip Type
VR
IF
IDC10D120T6M 1200V 15A
Die Size 3.30 x 2.98 mm2
Package sawn on foil
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Pad metall Backside metall
Die bond Wire bond Reject ink dot size Recommended storage environment
3.30 x 2.98 9.83 / 5.33
mm2
2.346 x 2.
IDC10D120T6M Datasheet
