N-channel enhancement mode
For dynamic characterization refer to the datasheet of BSZ16DN25NS3 G
AQL 0.65 for visual inspection according to failure catalogue
Electrostatic Discharge Sensitive Device according to JEDEC
Die bond: soldered or glued
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MOSFET
MetalOxideSemiconductorFieldEffectTransistor
BareDie
OptiMOS™3PowerMOSTransistorChip IPC045N25N3
DataSheet
Rev.2.5 Final
Industrial&Multimarket
OptiMOS™3PowerMOSTransistorChip
IPC045N25N3
1Description
•N-channelenhancementmode •FordynamiccharacterizationrefertothedatasheetofBSZ16DN25NS3 G •AQL0.65forvisualinspectionaccordingtofailurecatalogue •ElectrostaticDischargeSensitiveDeviceaccordingtoJEDEC •Diebond:solderedorglued •Backsidemetallization:NiVsystem •Frontsidemetallization:AlSisystem •Passivation:nitride(onlyonedgestructure)
PowerMOSTransistorChip
Table1KeyPerformanceParameters
Parameter
Value
Unit
V(BR)DSS RDS(on) Die size
250 1651) 2.5 x 1.