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MOSFET
MetalOxideSemiconductorFieldEffectTransistor
BareDie
OptiMOS™3PowerMOSTransistorChip IPC218N06N3
DataSheet
Rev.2.5 Final
Industrial&Multimarket
OptiMOS™3PowerMOSTransistorChip
IPC218N06N3
1Description
•N-channelenhancementmode •FordynamiccharacterizationrefertothedatasheetofIPB017N06N3G •AQL0.65forvisualinspectionaccordingtofailurecatalogue •ElectrostaticDischargeSensitiveDeviceaccordingtoMIL-STD883C •Diebond:solderedorglued •Backsidemetallization:NiVsystem •Frontsidemetallization:AlCusystem •Passivation:nitride(onlyonedgestructure)
PowerMOSTransistorChip
Table1KeyPerformanceParameters
Parameter
Value
Unit
V(BR)DSS RDS(on) Die size
60 1.71) 5.9 x 3.