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MOSFET
MetalOxideSemiconductorFieldEffectTransistor
BareDie
OptiMOS™2PowerMOSTransistorChip IPC26N10NR
DataSheet
Rev.2.5 Final
Industrial&Multimarket
OptiMOS™2PowerMOSTransistorChip
IPC26N10NR
1Description
•N-channelenhancementmode •FordynamiccharacterizationrefertothedatasheetofIPP05CN10NG1) •AQL0.65forvisualinspectionaccordingtofailurecatalogue •ElectrostaticDischargeSensitiveDeviceaccordingtoMIL-STD883C •Diebond:solderedorglued •Backsidemetallization:NiVsystem •Frontsidemetallization:AlSisystem •Passivation:nitride(onlyonedgestructure)
PowerMOSTransistorChip
Table1KeyPerformanceParameters
Parameter
Value
Unit
V(BR)DSS RDS(on) Die size
100 5.42) 6.0 x 4.