N-channel enhancement mode
For dynamic characterization refer to the datasheet of IPP075N15N3 G1)
AQL 0.65 for visual inspection according to failure catalogue
Electrostatic Discharge Sensitive Device according to MIL-STD 883C
Die bond: soldered or
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MOSFET
MetalOxideSemiconductorFieldEffectTransistor
BareDie
OptiMOS™3PowerMOSTransistorChip IPC300N15N3R
DataSheet
Rev.2.6 Final
Industrial&Multimarket
OptiMOS™3PowerMOSTransistorChip
IPC300N15N3R
1Description
•N-channelenhancementmode •FordynamiccharacterizationrefertothedatasheetofIPP075N15N3G1) •AQL0.65forvisualinspectionaccordingtofailurecatalogue •ElectrostaticDischargeSensitiveDeviceaccordingtoMIL-STD883C •Diebond:solderedorglued •Backsidemetallization:NiVsystem •Frontsidemetallization:AlCusystem •Passivation:nitride(onlyonedgestructure)
PowerMOSTransistorChip
Table1KeyPerformanceParameters
Parameter
Value
Unit
V(BR)DSS RDS(on) Die size
150 7.