N-channel enhancement mode
For additional characteristic and max ratings refer to the datasheet of IPP110N20N3 G
AQL 0.65 for visual inspection according to failure catalogue
Electrostatic Discharge Sensitive Device according to MIL-STD 883C
Die bond
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MOSFET
MetalOxideSemiconductorFieldEffectTransistor
BareDie
OptiMOS™3PowerMOSTransistorChip IPC302N20N3
DataSheet
Rev.2.6 Final
Industrial&Multimarket
OptiMOS™3PowerMOSTransistorChip
IPC302N20N3
1Description
•N-channelenhancementmode •Foradditionalcharacteristicandmaxratingsrefertothedatasheetof IPP110N20N3G •AQL0.65forvisualinspectionaccordingtofailurecatalogue •ElectrostaticDischargeSensitiveDeviceaccordingtoMIL-STD883C •Diebond:solderedorglued •Backsidemetallization:NiVsystem •Frontsidemetallization:AlCusystem •Passivation:nitride(onlyonedgestructure)
PowerMOSTransistorChip
Table1KeyPerformanceParameters
Parameter
Value
Unit
V(BR)DSS RDS(on) Die size
200 121) 6.7 x 4.