Infineon Technologies LQFP-64
Package Outline
| Part No. | LQFP-64 |
|---|---|
| Datasheet | LQFP-64 Download |
| Manufacturer |  Infineon Technologies |
| Description | Package Outline |
| Buy | Stock & Price |
P/PG-LQFP-64-6, -8, -12, -19, -22 Package Outline 0.1±0.05 STAND OFF 1.4 ±0.05 1.6 MAX. 0.15 -+0.0.0065 0°...7° 15 x 0.5 = 7.5 H 0.5 0.2 +0.07 -0.03 C 0.08 C 64x SEATING COPLANARITY PLANE 0.08 M A-B D C 64x 0.5 x 45° 12 10 1) D 0.2 A-B D 64x 0.2 A-B D H 4x A B 0.6 ±0.15 Bottom View Ex Ox Exposed Diepad 10 1) 12 Ey Oy 64 1 Index Marking 64 1 Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side Exposed Diepad Dimensions Package Leadframe Ex Ey Ox Oy PG-LQFP-64-8 C66065-A6866-C005 5 5 0 0 PG-LQFP-64-6 C66065-A6866-C013 5.6 5.6 0 0 PG-LQFP-64-12 C66065-A6866-C018 4 4 0 0 PG-LQFP-64-6, -22 C66065-A6866-C019 5.4 5.4 0 0 PG-LQFP-64-19 C66065-A6866-C020 5.8 5.8 0 0 Foot Print Soldering Type: Reflow Soldering 0.5 1.35 11.45 0.29 Ey 0.5 1.35 Package Information Ex 0.29 11.45 Thermal Pad Published by Infineon Technologies AG P/PG-LQFP-64-6, -8, -12, -19, -22 G 12.35 24 Marking Layout Manufacturer Pin 1 Marking Assembly site code (E for Infineon mal) Tape and Reel Re...
