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SIDC03D65C8
Fast switching diode chip in EMCON 3 -Technology
Recommended for:
A
Features:
• Power module
• 650V EMCON 3 technology 65 µm chip • Discrete components
• Soft, fast switching
• Low reverse recovery charge
C
• Small temperature coefficient
Applications:
• Qualified according to JEDEC for target • Drives
applications
• White goods
• Resonant applications
Chip Type
VR
I 1)
Fn
Die Size
Package
SIDC03D65C8 650V 10A 1.82 x 1.82 mm2
sawn on foil
1 ) nominal forward current at Tc = 100°C, not subject to production test - verified by design/characterisation
Mechanical Parameters Die size Area total Anode pad size Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal
1.82 x 1.82 3.31
1.39 x 1.
SIDC03D65C8 Datasheet
