SIDC50D60C8 Datasheet | Infineon

Fast switching diode chip in Emitter Controlled 3 -Technology Features : This chip is used for: - 600V Emitter Controlled 3 technology - Power module 70 µm chip - soft, fast switching - low reverse recovery charge - small temperature coefficient Applications: - Drives Chip Type SIDC50D60C8 600V 200A Die Size 9.2 x 5.44 mm2 Package sawn on foil Mechanical Parameters Raster size Area total Anode pad size Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal Backside metal Die bond Wire bond Reject ink dot size Remended storage environment 9.2 x 5.44 50.05 mm2 8.58 x 4.82 µm 200 mm Photoimide 3200 nm...