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IGBT Chip in NPT-technology
FEATURES: • 600V NPT technology • 100µm chip • short circuit prove • positive temperature coefficient • easy paralleling
SIGC03T60SNC
This chip is used for: • IGBT Modules
Applications: • drives
C G
E
Chip Type SIGC03T60SNC
VCE
ICn
600V 2A
Die Size 1.78 x 1.78 mm2
Package Ordering Code
sawn on foil
Q67041-A3000A002
MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization
Collector metallization
Die bond Wire bond Reject Ink Dot Size
Recommended Storage Environment
1.78 x 1.78
mm2
3.2 / 1.7
1.1 x 1.1 (L-shaped)
0.55 x 0.
SIGC03T60SNC Datasheet
