IDT72V233 Overview
3.3 VOLT HIGH-DENSITY SUPERSYNC II™ NARROW BUS FIFO 512 x 18/1,024 x 9, 1,024 x 18/2,048 x 9 2,048 x 18/4,096 x 9, 4,096 x 18/8,192 x 9 8,192 x 18/16,384 x 9, 16,384 x 18/32,768 x 9 32,768 x 18/65,536 x 9, 65,536 x 18/131,072 x 9 IDT72V223, IDT72V233.
IDT72V233 Key Features
- x9 in to x9 out
- x9 in to x18 out
- x18 in to x9 out
- x18 in to x18 out Pin to Pin patible to the higher density of IDT72V2103/72V2113 Big-Endian/Little-Endian user selectabl
- Fixed, low first word latency Zero latency retransmit Auto power down minimizes standby power consumption Master Reset c
- Available on the BGA package only
- INPUT REGISTER
- RCLK/RD
- TCK TRST TMS TDI TDO
- OE Q0 -Qn (x9 or x18)