InterFET Corporation IFN6449
The -300V InterFET IFN6449 and IFN6450 are targeted for high voltage applications. The TO-39 package is hermetically sealed and suitable for military applications.FEATURES
● InterFET N0042SY Geometry● High Voltage
● Low Input Capacitance: 3pF Maximum
● RoHS Compliant
● SMT, TH, and Bare Die Package options.
APPLICATIONS
● High VoltageDESCRIPTION
Gate/Case Drain 2 Source TO-39 Bottom View 3 1 Product Summary Parameters BVGSS Gate to Source Breakdown Voltage IDSS Drain to Source Saturation Current VGS(off) Gate to Source Cutoff Voltage GFS Forward Transconductance IFN6449 Min -100 2 -2 0.5 Ordering Information Custom Part and Binning Options Available Part NumberDESCRIPTION
IFN6449; IFN6450 Through-Hole IFN6449COT; IFN6450COT Chip Orientated Tray (COT Waffle Pack) IFN6449CFT; IFN6450CFT Chip Face-up Tray (CFT Waffle Pack) Case TO-39 COT CFT IFN6450 Min Unit -100 V 2 mA -2 V 0.5 mS Packaging Bulk 400/Waffle Pack 400/Waffle Pack Disclaimer: It is the Buyers responsibility for designing, validating and testing the end application under all field use cases and extreme use conditions. Guaranteeing the application meets required standards, regulatory compliance, and all safety and security requirements is the responsibility of the Buyer.