Datasheet4U Logo Datasheet4U.com

GB30RF60K - IGBT PIM MODULE

Features

  • Low VCE (on) Non Punch Through IGBT Technology Low Diode VF 10μs Short Circuit Capability Square RBSOA VCES = 600V IC = 27A @ TC=80°C tsc > 10μs @ TJ =150°C ECONO2 PIM VCE(on) typ. = 2.04V.

📥 Download Datasheet

Datasheet preview – GB30RF60K

📁 Similar Datasheet

  • GB30NC60K - IGBT (STMicroelectronics)
  • GB30NC60W - IGBT (STMicroelectronics)
  • GB30V60DF - IGBT (STMicroelectronics)
  • GB3221 - Preconfigured DSP System (ON Semiconductor)
  • GB3225 - Preconfigured DSP System (ON Semiconductor)
  • GB330 - High Frequency Inverter (GTM)
  • GB340 - High Frequency Inverter (GTM)
  • GB351N - 35.0 Ampere Heatsink Block Automotive Rectifier Diodes (Thinki Semiconductor)
  • GB352N - 35.0 Ampere Heatsink Block Automotive Rectifier Diodes (Thinki Semiconductor)
  • GB353N - 35.0 Ampere Heatsink Block Automotive Rectifier Diodes (Thinki Semiconductor)
Other Datasheets by International Rectifier

    Full PDF Text Transcription

    Click to expand full text
    Bulletin I27303 01/07 GB30RF60K IGBT PIM MODULE Features • • • • Low VCE (on) Non Punch Through IGBT Technology Low Diode VF 10μs Short Circuit Capability Square RBSOA VCES = 600V IC = 27A @ TC=80°C tsc > 10μs @ TJ =150°C ECONO2 PIM VCE(on) typ. = 2.
    Published: |