GB75YF120N Overview
Bulletin I27209 01/06 GB75YF120N IGBT FOUR PAK MODULE.
GB75YF120N Key Features
- Square RBSOA
- HEXFRED low Qrr, low Switching Energy
- Positive VCE(on) Temperature Coefficient
- Copper Baseplate
- Low Stray Inductance Design
- Benchmark Efficiency for SMPS appreciation in particular HF welding
- Rugged Transient Performance
- Low EMI, Requires Less Snubbing
- Direct Mounting to Heatsink space saving
- PCB Solderable Terminals
