IR130CSP
IR130CSP is Flipky manufactured by International Rectifier.
Features z z z z z
Ultra Low VF per Footprint Area Low Thermal Resistance One-fifth Footprint of SMA Super Low Profile (<.8mm) Available Tested on Tape & Reel
Flipky TM
Major Ratings and Characteristics Characteristics
IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 µs sine VF TJ @ 1.0 Apk, TJ=125°C range
Description
Units
A V A V °C True chip-scale packaging is available from International Rectifier. The IR130CPS surface-mount Schottky rectifier has been designed for applications requiring low forward drop and very small foot prints on PC boards. Typical applications are in disk drives, switching power supplies, converters, free-wheeling diodes, battery charging, and reverse battery protection. z z z z
IR130CPS
1.0 30 220 0.33
- 55 to 150
Small foot print, surface mountable Low forward voltage drop High frequency operation Guard ring for enhanced ruggedness and long term reliability
The Flipky TM package, is one-fifth the footprint of a parable SMA package and has a profile of less then .8mm. bined with the low thermal resistance of the die level device, this makes the Flipky TM the best device for application where printed circuit board space is at a premium and in extremely thin application environments such as battery packs, cell phones and PCMCIA cards.
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Bulletin I0182J 08/05
Voltage Ratings
Part number
VR Max. DC Reverse Voltage (V) VRWM Max. Working Peak Reverse Voltage (V)
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Absolute Maximum Ratings
Parameters
IF(AV) Max. Average Forward Current IFSM EAS IAR Max. Peak One Cycle Non-Repetitive Surge Current @ 25°C Non- Repetitive Avalanche Energy Repetitive Avalanche Current
Value
1.0 220 21 10 2.0
Units
Conditions
50% duty cycle @ TPCB = 120 °C, rectangular wave form 5µs Sine or 3µs Rect. pulse 10ms Sine or 6ms Rect. pulse Following any rated load condition and with rated V RRM applied m J A
TJ = 25 °C, IAS = 2.0A, L = 5.0m H Current decaying linearly to zero in 1 µsec Frequency limited by TJ max. Va = 1.5 x Vr...