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IRF2807SPbF - HEXFET Power MOSFET

Download the IRF2807SPbF datasheet PDF. This datasheet also covers the IRF2807LPbF variant, as both devices belong to the same hexfet power mosfet family and are provided as variant models within a single manufacturer datasheet.

General Description

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4.

Key Features

  • or Logic Level and 3V Drive Devices Fig 14. For N-channel HEXFET® power MOSFETs www. irf. com 7 IRF2807S/LPbF D2Pak Package Outline Dimensions are shown in millimeters (inches) D2Pak Part Marking Information (Lead-Free) T H IS IS AN IR F 5 3 0 S W IT H L O T CO D E 8 0 2 4 AS S E M B L E D O N W W 0 2 , 2 0 0 0 IN T H E AS S E M B L Y L IN E "L " N ote: "P " in as s em bly lin e po s i tion in dicates "L ead-F r ee" IN T E R N AT IO N AL R E CT IF IE R L O GO AS S E M B L Y L O T CO D E P AR.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IRF2807LPbF_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
IRF2807S N-Channel MOSFET INCHANGE
IRF2807 N-Channel MOSFET INCHANGE
IRF2807L N-Channel MOSFET INCHANGE
IRF2807Z N-Channel MOSFET INCHANGE
IRF2807ZL N-Channel MOSFET INCHANGE

Other Datasheets by International Rectifier (now Infineon)

Part Number Description
IRF2807S Power MOSFET
IRF2807 Power MOSFET
IRF2807L Power MOSFET
IRF2807LPbF HEXFET Power MOSFET
IRF2807PbF HEXFET Power MOSFET

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Advanced Process Technology Ultra Low On-Resistance l Dynamic dv/dt Rating l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated l Lead-Free Description l l IRF2807SPbF IRF2807LPbF D PD - 95945 HEXFET® Power MOSFET VDSS = 75V RDS(on) = 13mΩ S G www.DataSheet4U.com The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF2807L) is available for lowprofile applications.