IRF3708SPbF Overview
30 ±12 62 52 248 87 61 0.58 -55 to + 175 RθJC RθCS RθJA RθJA Parameter Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient Junction-to-Ambient (PCB mount) Typ. 0.50 When mounted on 1" square PCB (FR-4 or G-10 Material) . For remended footprint and soldering techniques refer to application note #AN-994 Max.
IRF3708SPbF Key Features
- High Frequency DC-DC Isolated Converters with Synchronous Rectification for Tele and Industrial Use
- High Frequency Buck Converters for puter Processor Power
- Lead-Free HEXFET® Power MOSFET VDSS 30V RDS(on) max 12mΩ ID 62A Benefits
- Ultra-Low Gate Impedance
- Very Low RDS(on) at 4.5V VGS
