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IRFBF20L - Power MOSFET

Description

Third generation HEXFETs from international Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The D2Pak is a surface mount power package capable ofthe accommodatingdie sizes up to HEX-4.

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PD - 9.1665 PRELIMINARY l l l l l l l IRFBF20S/L HEXFET® Power MOSFET D Surface Mount (IRFBF20S) Low-profile through-hole (IRFBF20L) Available in Tape & Reel (IRFBF20S) Dynamic dv/dt Rating 150°C Operating Temperature Fast Switching Fully Avalanche Rated VDSS = 900V RDS(on) = 8.0Ω G ID = 1.7A S Description Third generation HEXFETs from international Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2Pak is a surface mount power package capable ofthe accommodatingdie sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package.
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