IRFDC20 Description
Third Generation HEXFETs from International Rectifier provide the designer with the best bination of fast switching, ruggedized device design, low onresistance and cost-effectiveness. The 4-pin DIP package is a low-cost machine-insertable case style which can be stacked in multiple binations on standard 0.1 inch pin centers. The dual drain serves as a thermal link to the mounting surface for power dissipation levels...