IRFE9130 Datasheet | International Rectifier

Description The leadless chip carrier (LCC) package represents the logical next step in the continual evolution of surface mount technology. Designed to be a close replacement for the TO39 package, the LCC will give designers the extra flexibility they need to increase circuit board density. IR Hi Rel has engineered the LCC package to meet the specific needs of the power market by increasing the size of the bottom source pad, thereby enhancing the thermal and electrical performance. The lid of the package is grounded to the source to reduce RF interference. LCC-18 Features - Surface Mount - Small Footprint - Alternative to TO-39 Package - Hermetically Sealed - Dynamic dv/dt Rating - Avalanche Energy Rating - Simple Drive Requirements - Light Weight - ESD Rating: Class 1C per MIL-STD-750, Method 1020 Absolute Maximum Ratings Symbol Parameter ID1 @ VGS = -10V, TC = 25°C Continuous Drain Current ID2 @ VGS = -10V, TC = 100°C Continuous Drain Current IDM @ TC = 25°C Pulsed Drain Current  PD @ TC = 25°C Maximum Power Dissipation Linear Derating Factor VGS EAS IAR EAR dv/dt Gate-to-Source Voltage Single Pulse Avalanche Energy  Avalanche Current  Repetitive Avalanche Energy  Peak Diode Recovery dv/dt  Operating Junction and TSTG Storage Temperature Range Package Mounting Surface Temp. Weight Value -6.5 -4.1 -25 25 0.20 ± 20 165 -6.5 2.5 -5.5 -55 to + 150 300 (for 5 s) 0.42 (Typical) For Footnotes, refer to the page 2. International Rectifier Hi Rel Products,...