IRFHM9391TRPBF
Features
Low Thermal Resistance to PCB (<3.8°C/W) Low Profile (<1.05 mm) Industry-Standard Pinout patible with Existing Surface Mount Techniques Ro HS pliant, Halogen-Free MSL1,Consumer Qualification
Benefits Enable better Thermal Dissipation results in Increased Power Density Multi-Vendor patibility Easier Manufacturing Environmentally Friendlier Increased Reliability
Base part number
IRFHM9391Pb F
Package Type
PQFN 3.3mm x 3.3mm
Standard Pack
Form
Quantity
Tape and Reel
Orderable Part Number IRFHM9391TRPb F
Absolute Maximum Ratings
VGS ID @ TA = 25°C ID @ TA= 70°C IDM ID @ TC(Bottom) = 25°C ID @ TC(Bottom) = 100°C ID @ TC = 25°C
PD @TA = 25°C PD @TC(Bottom) = 25°C
TJ TSTG
Parameter Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V (Source Bonding Technology Limited) Power Dissipation
- Power...
