Minimum Order Quantity Die in Sale Package 2500 n.a 2500 2500
Inked Probed Unsawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film
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SC070xxxxx5P SC070xxxxx5F
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www.DataSheet4U.com Bulletin I0509J rev. A 05/01 SC070.....5. Series SCHOTTKY DIE 70 x 92 mils a c 0.35 ± 0.01 (14 ± 0.4) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETER...
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.35 ± 0.01 (14 ± 0.4) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C A D b d Ø 40 (157) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, - 0.005 (2 + 0, - 0.2) Wafer flat alligned with side b of the die Ø 125 (492) ww.DataSheet4U.com NOT TO SCALE NOTE: 10 mils die thickness is available on specific request only. Contact factory for information. www.irf.com 1 www.DataSheet4U.com www.DataSheet4U www.DataSheet4U.com 4U.com DataSheet 4
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