SPA6191 Overview
Key Specifications
Package: SIP
Mount Type: Through Hole
Pins: 4
Height: 11.4 mm
Description
The SPA Series ChipSwitch uses exclusive International Rectifier S3X power integrated circuit technology to form a fully functioning solid-state relay. The S3X technology combines MOS and bipolar processes, derived from IR’s HEXFET® power MOSFET designs, to eliminate the need for both discrete components and hybrid circuits.
