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HM6-6617B883 - 2K x 8 CMOS PROM

Description

The HM-6617/883 is a 16,384-bit fuse link CMOS PROM in a 2K word by 8-bit/word format with “Three-State” outputs.

This PROM is available in the standard 0.600 inch wide 24 pin SBDIP, the 0.300 inch wide slim SBDIP, and the JEDEC standard 32 pad CLCC.

Features

  • This Circuit is Processed in Accordance to MIL-STD883 and is Fully Conformant Under the Provisions of Paragraph 1.2.1.
  • Low Power Standby and Operating Power - ICCSB.
  • . . .100µA - ICCOP.
  • . 20mA at 1MHz.
  • Fast Access Time.
  • . . . 90/120ns.
  • Industry Standard Pinout.
  • Single 5.0V Supply.
  • CMOS/TTL Compatible Inputs.

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Datasheet preview – HM6-6617B883

Datasheet Details

Part number HM6-6617B883
Manufacturer Intersil Corporation
File Size 91.68 KB
Description 2K x 8 CMOS PROM
Datasheet download datasheet HM6-6617B883 Datasheet
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Full PDF Text Transcription

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HM-6617/883 March 1997 2K x 8 CMOS PROM Description The HM-6617/883 is a 16,384-bit fuse link CMOS PROM in a 2K word by 8-bit/word format with “Three-State” outputs. This PROM is available in the standard 0.600 inch wide 24 pin SBDIP, the 0.300 inch wide slim SBDIP, and the JEDEC standard 32 pad CLCC. The HM-6617/883 utilizes a synchronous design technique. This includes on-chip address latches and a separate output enable control which makes this device ideal for applications utilizing recent generation microprocessors. This design technique, combined with the Intersil advanced self-aligned silicon gate CMOS process technology offers ultra-low standby current. Low ICCSB is ideal for battery applications or other systems with low power requirements.
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