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TB386 - Implementing the HIP1011 on Hot Swap CPCI Boards

General Description

only.

Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.

Accordingly, the reader is cautioned to verify that data sheets are current before placing orders.

Key Features

  • Until now, CPCI Hot Swap features were offered as a vendor proprietary feature with little or no interoperability. www. DataSheet4U. com PICMG 2.1 R1.0 now defines three Hot Swap system models: Basic, Full and High Availability (HA) each of increasing complexity and automation. Intersil Tech Brief TB358 details the implementation of the HIP1011 on boards for the Basic and Full models. This Tech Brief details important specification enhancements as they pertain to Hot Swap and the HIP1011 solution.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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TM Implementing the HIP1011 on Hot Swap CPCI Boards for High Availability (HA) Platforms Technical Brief August 2000 TB386 P RE L I M I NA R Y Introduction The October 1999 release of the CompactPCI Specification PICMG 2.0 R3.0 defines for the CPCI environment such developments as 66MHz operation, 3.3V signaling, the addition of the System Manager, further definition and differentiation of Hot Swap (PICMG 2.1 R1.0) and improved mechanical features. Until now, CPCI Hot Swap features were offered as a vendor proprietary feature with little or no interoperability. www.DataSheet4U.com PICMG 2.1 R1.0 now defines three Hot Swap system models: Basic, Full and High Availability (HA) each of increasing complexity and automation.