BZT52C3V3 Datasheet PDF

FEATURES

： z Planar Die Construction z 350mW Power Dissipation on Ceramic PCB z General Purpose, Medium Current z Ideally Suited for Automated Assembly Processes z Available in Lead Free Version

MAXIMUM RATINGS

(Ta=25℃ unless otherwise specified) Characteristic Forward Voltage (Note 2) @ IF = 10mA Power Dissipation(Note 1) Thermal Resistance from Junction to Ambient Junction Temperature Storage Temperature Symbol VF PD RθJA TJ TSTG SOD-123 Value 0.9 350 357 150 -55~+150 Unit V mW ℃ /W ℃ ℃ 1 E,Mar,2015

ELECTRICAL CHARACTERISTICS

Ta=25℃ unless otherwise specified Type Number BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16 BZT52C18 BZT52C20 BZT52C22 BZT52C24 BZT52C27 BZT52C30