MMSZ5231C Datasheet PDF

FEATURES

● Planar Die Construction
● Ultra-Small Surface Mount Package
● General purpose, Medium Current
● Ideally Suited for Automated Assembly Processes SOD-123

MAXIMUM RATINGS

(Ta=25℃ unless otherwise specified) Characteristic Symbol Forward Voltage (Note 2) @ IF = 10mA VF Power Dissipation(Note 1) Pd TThheerrmmaallRReessisistatannccee,,JJuunncctitoionntotoAAmmbbieiennttAAirir RRθJA Junction Temperature Storage Temperature Range Tj Tstg Value 0.9 350 357 150 -55~+150 Notes:1. Device mounted on ceramic PCB; 5.0mm x 7.0 mm with pad areas 35 mm2. 2. Tested with pulses, Tp≤1.0ms. Unit V mW ℃/W Я Я 1 C,Nov,2014

ELECTRICAL CHARACTERISTICS

Ta=25℃ unless otherwise specified Type Number MMSZ5221C MMSZ5223C MMSZ5225C MMSZ5226C MMSZ5227C MMSZ5228C MMSZ5229C MMSZ5230C MMSZ5231C MMSZ5232C MMSZ5233C MMSZ5234C MMSZ5235C MMSZ