S2KBF
Overview
- For surface mounted applications
- Low profile package * Glass Passivated Chip Junction * Easy to pick and place A C B DE
- High Temp Soldering: 260℃ for 10seconds at Terminals G F DIM. A B C
- E F G SMBF INCHES MIN
- 201 0.138 0.165 0.075 0.043 0.007 0.031 MAX
- 217 0.146 0.173 0.087 0.051 0.010 0.047 Mechanical Data
- Case: SMBF Molded plastic * Terminals: Solderable per MIL-STD-750, Method 2026 * Polarity: Indicated by cathode band
