GS3D Overview
Key Specifications
Max Operating Temp: 150 °C
Min Operating Temp: -55 °C
Description
Plastic package has underwriters laboratories flammability classification 94V-0 Exceeds environmental standards of MIL-S-19500/228 For surface mounted applications in order to optimize board space Glass passivated chip junction Lead free in compliance with EU RoHS 2011/65/EU directive Low forward voltage drop DO-214AB (SMC) MECHANICAL DATA Case: JEDEC DO-214AB molded plastic Terminals: Solder plated, solderable per MIL-STD-750, method 2026 Polarity: Color band denotes cathode end Weight: 0.26 gram Symbol ABSOLUTE MAXIMUM RATING AND (Rating at 25℃ ambient temperature unless otherwise specified.) Parameter Symbol GS3A GS3B GS3D GS3G GS3J GS3K GS3M Unit Maximum repetitive peak reverse voltage Maximum non-repetitive peak reverse voltage Maximum RMS voltage VRRM VRSM VRMS 50 100 200 400 600 800 1000 V 55 110 220 440 660 880 1100 V 35 70 140 280 420 560 700 V Maximum DC blocking voltage Maximum average forward current at TL=105℃ Peak forward surge current: 8.3ms single half sine-wave superimposed on rated load VDC IF(AV) IFSM 50 100 200 400 600 800 1000 V 3.0 A 100 A Maximum forward voltage @ IF=3.0A VF 1.1 V Maximum DC reverse current Tj=25℃ at rated DC blocking voltage Tj=150℃ IR 5.0 µA 500 Typical junction capacitance VR=4.0V, f=1MHz CJ 30 pF Operating junction and storage temperature range Tj , Tstg -60 to +150 ℃ TEL：+86-513-83639777 -1 / 4- GS3A~GS3M JieJie Microelectronics CO. Ltd THERMAL RESISTANCES Symbol Parameter GS3A GS3B GS3D GS3G GS3J GS3K GS3M Unit Rth(j-L) Junction to lead (note1) 15 ℃/W Note1： MARKING 3H1 GS3M PACKAGE MECHANICAL DATA B F A C H D E G JK J DO-214AB (SMC) L G General Purpose Diode S Surface Mount 3 IF(AV)=3.0A M VRRM:1000V xH1：.
