Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5%
JF
High temperature soldering guaranteed:260℃/10 seconds at terminals
Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC.
The following content is an automatically extracted verbatim text
from the original manufacturer datasheet and is provided for reference purposes only.
View original datasheet text
R SEMICONDUCTOR
MM3Z2V0 THRU MM3Z120
0.3W SILICON PLANAR ZENER DIODES
FEATURES
Total power dissipation:max.300 mW Small plastic package suitable for surface mounted design Tolerance approximately ±5%
JF
High temperature soldering guaranteed:260℃/10 seconds at terminals
Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
MECHANICAL DATA
Case: SOD-323 plastic case Weight: Approx. 0.004 gram
SOD-323
(0.35
+0.05 -0.05
)
0.014"+-00..000022""
(1.70±0.10(
0.067"+-0.004
0.006"(0.150) MAX
(2.55±0.25) 0.100"±0.010" 5°
(1.25+-00..1100 ) 0.049"+-00..000044""
(0.95±0.15) 0.037"±0.
MM3Z2V0 Datasheet
