B9P-SHF-1AA Datasheet | JST

Features - - - - - - - - - - - - - - - - - - - - - - - - - Superior folded beam construction (1) This sturdy construction withstands repeated stress, resists permanent deformation, and offers a very long service life. (2) This contact design has a large tolerance for variations in .. mating post thickness and resists deformation when pried. - Whisker prevention The header post is copper-undercoated and tin/lead-plated to prevent whiskers from being generated and to provide good solderability. - Wide, sturdy post The post has a large cross-sectional area to resist prying during insertion into printed circuit boards and mating with connector housings. - Molded-in header This 2.5mm (.098") pitch connector is used to interconnect printed circuit boards in parallel, vertically or horizontally. The posts are molded into the insulator to provide stability when mounted on printed circuit boards. This also prevents flux from entering the connector during soldering. Specifications - - - - - - - - - - - - - - - - - - - - Current rating: 3A AC, DC - Voltage rating: 250V AC, DC - Temperature range: -25˚C to +85˚C (including temperature rise in applying electrical current) - Contact resistance: Initial value/10m Ω max. After environmental testing/20m Ω max. - Insulation resistance: 500M Ω min. - Withstanding voltage: 1,500V AC/minute - Applicable PC board thickness:...