FI-AC3-1-15000 Datasheet | Japan Aviation Electronics

.. Connectors Printed circuit boards Board to cable 1.0mm Contact Spacing - For LCD interface for high speed differential transmission SMT Type - P. C. Board to Cable Application - Single row FI-X/FI-A Series Connectors Features Board-to-cable application for high density packaging. - low-profile SMT type receptacle 1.0 mm high on - Small, board (FI-X/slotted mount type) and 0.6mm (FI-A/slotted mount type). For differential transmission. - Precision impedance matching (100 ±10 ohms). - headers e with hold-down for preventing float up - Pin when soldering and offering additional retention on board. - - - - - The hold-down is incorporated with shell, enabling connection to the ground on board. Receptacle with a ground plate on both ends of wire terminal of contact, enabling connection to the ground on board. Design ensuring correct grounding. e in three types. Crimp type cable plug for discrete wire, ZIF type for FPC, and fine-wire coaxial type. (We can supply various cable harnessed connectors such as twinax. For further information, consult JAE's sales department) ZIF (zero insertion force) configuration for FPC application. No force is directly applied when inserting FPC. Easy to operate. The shell is connected to the ground on one side of FPC when inserting it. Receptacles can be supplied in embossed tape allowing automatic mounting. GENERAL SPECIFICATIONS No. of Contacts 14 (specifically designed for differential transmission/7 pairs) 14, 20, 30 (for fine-wire coaxial:20,30) 20 positions for FI-A 1 Amps 500 VACr.m.s. (for one minute) 100 megohms min. 40 milliohms max. #30 to #36 AWG (discrete wire) #40 AWG (fine-wire coaxial) 1.0 mm pitch FPC/0.14 mm thick -40°C to +80°C APPLICATIONS LCD interfaces, LCD inverter, PC, PDA, DVC, mobile phones, digital still cameras, various state-of-the-art miniature devices Current Rating D.W.Voltage TYPES & BINATIONS - - FI-X: Click the button. Insulation Resistance Contact...