Jingdao Microelectronics MM3Z68W
The recommended mounting pad size 1.2 1.4 1.2 (47) (55) (47) 1.2 (47) Unit: mm (mil) Rev 1.1 10-Jun-23 Page 3 of 3FEATURES
● Total power dissipation: Max. 300mW.● Wide zener reverse voltage range 2.0V to 75V.
● Small plastic package suitable for surface mounted design.
● Tolerance approximately±5%
● Qualified to AEC-Q101 Standards for High Reliability
MECHANICAL DATA
●Case: SOD-323W●Terminals: Solderable per MIL-STD-750, Method 2026
●Approx. Weight: 5.48mg / 0.00019oz PINNING PIN
DESCRIPTION
1 Cathode 2 Anode 2 1 Top View Simplified outline SOD-323W and symbol Value UnitABSOLUTE MAXIMUM RATINGS
And Characteristics Parameter Power Dissipation Forward Voltage at IF = 10 mA Typical thermal resistance juncting to ambient Operating and Storage Temperature Range (Ta = 25 °C) Symbol P tot VF (1) RθJA T j ,Tstg Value 300 0.9 417 -55 ~ +150 (1) Thermal resistance from junction to ambient at P.C.B. mounted with 2 .0" X 2.0" (5 X 5 cm) copper areas pads. Unit mW V °C/W °C Power Dissipation (W) Transient Thermal Impedance( °C/W) Fig.1 Maximum Continuous Power Derating 0.6 0.5 0.4 0.3 0.2 0.1 0.0 25 50 75 1...