TB1S-10 Overview
1 Input Pin（~） 2 Input Pin（~） 3 Output Anode（+） 4 Output Cathode（-） Case: Solderable per MIL-STD-750, Method 2026 Approx. 88mg / 0.0031oz 3 4 2 1 ABS/LBF Package Maximum Ratings and Ratings at 25 °C ambient temperature unless otherwise specified.
TB1S-10 Key Features
- Glass Passivated Chip Juntion
- Reverse Voltage
- 100 to 1000 V
- Forward Current
- High Surge Current Capability
- Designed for Surface Mount Application
- Case: ABS/LBF
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 88mg / 0.0031oz